High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Resultados: 2,051
Seleccionar Imagen N.° de pieza Fabricante: Descripción Hoja de datos Disponibilidad Precio: (USD) Filtre los resultados en la tabla por precio unitario en función de su cantidad. Cantidad RoHS Modelo ECAD Producto Número de posiciones Paso Número de filas Estilo de terminación Ángulo de montaje Altura de pila Régimen de corriente Régimen de voltaje Velocidad de transmisión de datos máxima Temperatura de trabajo mínima Temperatura de trabajo máxima Revestimiento del contacto Material del contacto Material del alojamiento Serie Empaquetado
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 519En existencias
Min.: 1
Mult.: 1
Carrete: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 620En existencias
Min.: 1
Mult.: 1
Carrete: 200

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 184En existencias
Min.: 1
Mult.: 1
Carrete: 375

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 312En existencias
Min.: 1
Mult.: 1
Carrete: 400

Headers 40 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 461En existencias
Min.: 1
Mult.: 1
Carrete: 225

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 155En existencias
Min.: 1
Mult.: 1
Carrete: 125

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 14 mm, 15 mm, 15.5 mm, 16.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 360En existencias
Min.: 1
Mult.: 1
Carrete: 375

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 97En existencias
Min.: 1
Mult.: 1
Carrete: 75

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 14 mm, 15 mm, 15.5 mm, 16.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 582En existencias
Min.: 1
Mult.: 1
Carrete: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 178En existencias
Min.: 1
Mult.: 1
Carrete: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 327En existencias
Min.: 1
Mult.: 1
Carrete: 375

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 150En existencias
Se puede aplicar una tarifa de 10 % si el envío es a los Estados Unidos.
Min.: 1
Mult.: 1
Carrete: 150

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 279En existencias
Se puede aplicar una tarifa de 10 % si el envío es a los Estados Unidos.
Min.: 1
Mult.: 1
Carrete: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 165En existencias
Min.: 1
Mult.: 1
Carrete: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 343En existencias
Min.: 1
Mult.: 1
Carrete: 325

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 41En existencias
Min.: 1
Mult.: 1
Carrete: 50

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM-RA Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 225En existencias
Min.: 1
Mult.: 1
Carrete: 200

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 202En existencias
Min.: 1
Mult.: 1
Carrete: 175

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 66En existencias
Min.: 1
Mult.: 1
Carrete: 75

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 196En existencias
Min.: 1
Mult.: 1
Carrete: 325

Sockets 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 101En existencias
Se puede aplicar una tarifa de 10 % si el envío es a los Estados Unidos.
Min.: 1
Mult.: 1
Carrete: 100

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 96En existencias
Min.: 1
Mult.: 1
Carrete: 125

Connectors 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 387En existencias
Min.: 1
Mult.: 1
Carrete: 550

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 436En existencias
Min.: 1
Mult.: 1
Carrete: 375

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 107En existencias
Min.: 1
Mult.: 1
Carrete: 225

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape