High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Resultados: 2,051
Seleccionar Imagen N.° de pieza
 Fabricante:
Descripción Hoja de datos Disponibilidad Precio: (USD) Filtre los resultados en la tabla por precio unitario en función de su cantidad.
Cantidad RoHS Modelo ECAD Producto
Número de posiciones
Paso
Número de filas
Estilo de terminación
Ángulo de montaje
Altura de pila
Régimen de corriente
Régimen de voltaje
Velocidad de transmisión de datos máxima
Temperatura de trabajo mínima
Temperatura de trabajo máxima
Revestimiento del contacto
Material del contacto
Material del alojamiento
Serie
Empaquetado
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
113En existencias
Se puede aplicar una tarifa de 10 % si el envío es a los Estados Unidos.
Min.: 1
Mult.: 1
Carrete: 150

Connectors 200 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
70En existencias
Min.: 1
Mult.: 1
Carrete: 75

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
2En existencias
Min.: 1
Mult.: 1
Carrete: 100

Sockets 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
45En existencias
Min.: 1
Mult.: 1
Carrete: 75

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
76En existencias
Min.: 1
Mult.: 1
Carrete: 100

Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
94En existencias
Min.: 1
Mult.: 1
Carrete: 100

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
121En existencias
2,100Se espera el 05/05/2026
Se puede aplicar una tarifa de 10 % si el envío es a los Estados Unidos.
Min.: 1
Mult.: 1
Carrete: 700

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
91En existencias
Min.: 1
Mult.: 1
Carrete: 550

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
130En existencias
Min.: 1
Mult.: 1
Carrete: 325

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
318En existencias
Min.: 1
Mult.: 1
Carrete: 350
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
319En existencias
Se puede aplicar una tarifa de 10 % si el envío es a los Estados Unidos.
Min.: 1
Mult.: 1
Carrete: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
289En existencias
Min.: 1
Mult.: 1
Carrete: 300

LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
353En existencias
Min.: 1
Mult.: 1
Carrete: 475

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
78En existencias
Min.: 1
Mult.: 1
Carrete: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
33En existencias
300Se espera el 03/02/2026
Min.: 1
Mult.: 1
Carrete: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
46En existencias
Min.: 1
Mult.: 1
Carrete: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
262En existencias
Se puede aplicar una tarifa de 10 % si el envío es a los Estados Unidos.
Min.: 1
Mult.: 1
Carrete: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
128En existencias
Min.: 1
Mult.: 1
Carrete: 125

Connectors 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
70En existencias
Min.: 1
Mult.: 1
Carrete: 125

Connectors 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
86En existencias
Min.: 1
Mult.: 1
Carrete: 125

Connectors 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
89En existencias
125Se espera el 03/02/2026
Min.: 1
Mult.: 1
Carrete: 125

Connectors 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
174En existencias
Min.: 1
Mult.: 1
Carrete: 175

Connectors 400 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050" SEARAY High-Speed High-Density Open-Pin-Field Array Socket, 30 Pos, 4 Row
Hoja de datos
2En existencias
Se puede aplicar una tarifa de 10 % si el envío es a los Estados Unidos.
Min.: 1
Mult.: 1
Carrete: 325

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
120En existencias
Min.: 1
Mult.: 1
Carrete: 175

Connectors 200 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
207En existencias
Min.: 1
Mult.: 1
Carrete: 325

Headers 40 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape