
Allegro MicroSystems ACS70312 Linear Hall-Effect Sensor ICs
Allegro MicroSystems ACS70312 Linear Hall-Effect Sensor ICs feature reverse battery protection and high-bandwidth analog output for core-based current sensing. These ICs incorporate a Hall element with BiCMOS integrated circuitry to provide a fully monolithic linear current sensor IC. The ACS70312 ICs are sensitive to magnetic flux density orthogonal to the IC package surface, and the output is an analog voltage proportional to the applied flux density. These ICs are used with a ferromagnetic core to provide highly accurate current sensing. The ACS70312 ICs feature factory-programmed gain and offset drift over temperature and deliver a solution with ±1% sensitivity error and ±5mV offset error. These ICs have a high operating bandwidth from DC to 240kHz and a fast 2µs response time. The ACS70312 linear Hall-effect sensor ICs operate within the −40°C to 150°C temperature range.Features
- Factory-programmed segmented linear Temperature Compensation (TC) provides ultralow thermal drift:
- ±1% sensitivity error
- ±5mV offset error
- On-board supply regulator with reverse-battery protection provides high immunity to Electrical Overstress (EOS)
- 2µs very fast response time
- DC to 240kHz high operating bandwidth
- AEC-Q100 Grade 0, automotive qualified
- Customer-programmable, high-resolution offset, and sensitivity trim
- Extremely low noise and high resolution achieved via proprietary Hall element and low-noise amplifier circuits
- Patented circuits suppress IC output spiking during fast current step inputs
- Wide selectable sensitivity range between 0.5mV/G and 8mV/G
- User-selectable ratiometric behavior of sensitivity, quiescent voltage, and clamps
- Open-circuit detection on the GND pin (broken wire)
- Customer-programmable output voltage clamps provide short-circuit diagnostic capabilities
- Undervoltage Detection (UVD)
- Low-voltage programming
- −40°C to 150°C wide ambient temperature range
- Immune to mechanical stress
- 1mm case thickness extremely thin package
Block Diagram

Typical Application Diagram

Publicado: 2024-04-15
| Actualizado: 2024-04-25