Infineon Technologies Ultra-Low Power PDM XENSIV™ MEMS Microphones

Infineon Technologies Ultra-Low Power Digital PDM XENSIV™ MEMS Microphones are designed for applications which require long battery life and environmental robustness in a small package. These microphones feature a Signal-to-Noise Ratio (SNR) of 66.5dB(A) and 68dB(A), and a low corner frequency of 20Hz. The XENSIV™ MEMS microphones offer enhanced RF shielding and digital Pulse Density Modulation (PDM) output. Typical applications include smartphones and mobile devices, high-quality audio capturing, devices with Voice User Interface (VUI), industrial, or home monitoring with audio pattern detection.

Features

  • 580µA low current consumption in normal mode
  • 190µA ultra-low current consumption in low power mode
  • Signal-to-noise ratio (SNR):
    • 66.5dB(A) (IM66D132HV01)
    • 68dB(A) (IM68D121JV01)
  • Flat frequency response with low frequency roll-off at 20Hz
  • Component-level IP57 dust and water resistant
  • Enhanced RF shielding
  • Digital PDM output
  • Bottom port
  • Halogen free
  • RoHS compliant
  • 3.5mm x 2.65mm x 0.98mm package dimensions

Applications

  • Smartphones and mobile devices
  • Active Noise Cancellation (ANC) headphones and earbuds
  • High-quality audio capturing:
    • Laptops and tablets
    • Conference systems
    • Cameras, camcorders, and camera accessories
  • Devices with Voice User Interface (VUI):
    • Smart speakers
    • Home automation
    • IOT devices
  • Industrial or home monitoring with audio pattern detection

Block Diagram

Block Diagram - Infineon Technologies Ultra-Low Power PDM XENSIV™ MEMS Microphones

Dimension Diagram

Mechanical Drawing - Infineon Technologies Ultra-Low Power PDM XENSIV™ MEMS Microphones
Publicado: 2025-09-25 | Actualizado: 2025-10-28