Ezurio Sterling™ LWB+ Wi-Fi® 4 & BLUETOOTH® 5.2 Modules

Ezurio Sterling™ LWB+ Wi-Fi^® 4 and BLUETOOTH^® 5.2 Modules are based upon the Infineon AIROC™ CYW43439 chipset. The Sterling LWB+ Modules are a System-in-Package (SIP) with two certified module versions, supporting either an onboard chip antenna or an MHF connector for an external antenna. The Sterling LWB+ is intended to meet medical and industrial IoT connectivity requirements.

The Ezurio Sterling LWB+ Wi-Fi 4 and Bluetooth 5.2 Modules include a fully featured Wi-Fi 4 radio, enabled with software drivers and support. The secure, high-performance SDIO solution allows easy integration with any Linux or Android-based system. The Modules are fully certified, easy to integrate, and are a fast route to the market for wireless IoT applications.

Features

IEEE 802.11 b/g/n (single stream n)
Typical WLAN Transmit Power:
- +18.0dBm, 11Mbps, CCK (b)
- +16.0dBm, 54Mbps, OFDM (g)
- +15.0dBm, HT20 MCS7 (n)
Typical WLAN Sensitivity:
- -88dBm, 8% PER, 11Mbps (b)
- -75dBm, 10% PER, 54Mbps (g)
- -72dBm, 10% PER, MCS7 (n)
Bluetooth v5.0 BR /EDR/LE
Typical Bluetooth Transmit Power:
- 6.5dBm BDR
- 3.5dBm EDR
- 6.5dBm BLE
Typical Bluetooth Receive Sensitivity:
- -91dBm, 1DH5/2DH5
- -83dBm, 3DH5
- -91dBm, BLE
WLAN and Bluetooth coexistence

Available in two footprint styles and one M.2 2230 form factor:
- SMT Module at 15.5mm x 21mm
- SiP at 12mm x 12mm
- M.2 2230 at 22mm x 30mm x 2.25mm
Available with antenna trace pin, integrated chip antenna or MHF®
Four connectors for external antenna
Operating voltage at VBAT 3.2V to 4.8V (3.6V typical)
-40°C to +85°C Operating temperature
Operating humidity at less than 85% R.H.
-40°C to +125°C Storage temperature
Storage humidity at less than 60% R.H
Compact design based on Infineon CYW4349_A1 SoC
Worldwide acceptance: FCC, ISED (Canada), EU, MIC (Japan), and AS/NZS
BT SIG QDID: D056404
REACH and RoHS compliant