Laird Technologies BMI-S-608 Shield Frame

Laird Technologies BMI-S-608 Shield Frame is a one-part shielding solution with a stainless-steel design and without a top-mount cover. This shield frame includes rows of integrated contact spring fingers on each inner sidewall of the four-sided shield. The spring fingers grasp the heat sink housing directly and integrate the heat sink with the PCB’s heat-sensitive components. The shield frame reduces the spacing between adjacent shields and allows easier repairs of components. Additional features include excellent solderability and corrosion performance, <0.10mm typical flatness / coplanarity, and -40°C to +125°C operating temperature range. Laird Technologies BMI-S-608 Shield Frame is used in high-power computing, domain controllers, radio navigation systems, and instrument cluster displays.

Features

  • Enhanced design freedom involving PCB layout
  • Permits reduction in spacing between adjacent shields
  • Enables easier repairs of components
  • 1μm minimum underlayer nickel
  • Superior solderability and corrosion performance
  • Alternative to multi-component manufacturer solutions
  • Stainless steel X10 CrNi18-8, (EN 1.4310) base materials
  • -40°C to +125°C operating temperature range
  • 0.2mm material thickness
  • <0.10mm typical flatness / coplanarity

Applications

  • Automotive/ADAS/AVS
  • Infotainment smart boxes
  • Radio navigation systems
  • Instrument cluster displays
  • High power computing
  • Central vehicle controllers
  • Domain controllers

Videos

Publicado: 2024-05-31 | Actualizado: 2025-06-19