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Molex DDR4 miniDIMM Sockets

Molex DDR4 miniDIMM Sockets achieve the ultimate PCB space savings in enterprise computing and networking memory applications. The 0.60mm pitch, 22.5° angled or vertical mount sockets meet JEDEC standards. The angled socket offers highly robust mating, usability features for reliable operations and saves nearly half the overhead space of the vertical equivalent. Applications include small form factor PCs and small form factor servers, including 1U and blade servers.

Features

  • Small form factor design (approximately 2/3 smaller than standard DDR4 DIMM sockets)
  • Metal grips on the housing towers (patent pending) reduce shock or vibration to the mounted memory modules during transit
  • Latches that can withstand at least 25 mating cycles provide high durability in mission-critical applications
  • Profiled contacts with high normal force and excellent contact reliability
  • Designed to withstand two reflow cycles and ensures optimal performance under heat
  • Pick-and-place cap option for automated processing
  • Halogen-free and RoHS compliant

Applications

  • Data/computing
    • High-end computing
    • Personal computers
    • RAID/storage
  • Telecommunications/networking
    • Infrastructure
    • Network operations center

Specifications

  • Electrical
    • 29VAC(RMS)/DC maximum voltage
    • 0.75A maximum current per pin
    • Low-level contact resistance
      • 20mΩ for 151105 components
      • 25mΩ for 151134 components
    • 500VAC dielectric withstanding voltage
    • 1MΩ minimum insulation resistance
  • Mechanical
    • 150.0N maximum module insertion force with latches
    • 3.6kgf minimum module rip-out force
    • 25N maximum insertion force to PCB
    • Minimal terminal retention force
      • 300gf per pin
      • 8.0N per forklock
    • 35N maximum latch actuation force per latch
    • 25 cycle durability
  • -55°C to +85°C operating temperature range
  • For use with JEDEC MO-309 memory modules
  • Materials
    • UL 94V-0, black, glass-filled LCP housing
    • UL 94V-0, black, glass-filled polyamide latch
    • Copper alloy contacts
    • Plating
      • 0.76µ Gold (Au) over 1.25µ Nickel (Ni) in the contact area
      • 2.54µ Tin (Sn) over 1.25µ Nickel (Ni) in the soldertail area
      • 2.54µ Tin (Sn) over 1.25µ Nickel (Ni) for the PCB hold-down

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Publicado: 2015-09-16 | Actualizado: 2022-03-11