TE Connectivity BMC-Q Automotive Multilayer Chip Beads
TE Connectivity's (TE) BMC-Q Automotive Multilayer Chip Beads are AEC-Q200 qualified and are available in 0402, 0603, 0805, and 1204 packaging sizes. These chip beads are designed with monolithic inorganic material construction, giving them high and ultra-high current capability. BMC-Q series chip beads prevent undesirable noise, producing optimum signal transmission, and these chip beads shield against undesirable power loss for DC voltage applications. TE BMC-Q Automotive Multilayer Chip Beads are suitable for automotive multimedia systems, wireless connection systems, body comfort systems, and automotive low-power systems.
Features
- Low DC resistance
- Effective EMI protection
- AEC-Q200 qualified
- Monolithic inorganic material design structure
- Shields against undesirable power loss
- Prevents undesirable noise
- High moisture resistance
- Moisture sensitivity level (MSL) 2
Applications
- Automation controls
- Battery energy storage systems
- Electric vehicle industry
- Robotics
- Automotive multimedia systems
- Wireless connection systems
- Body comfort systems
- Automotive low-power systems
Additional Resources
Publicado: 2024-08-01
| Actualizado: 2024-08-13