Charging into the future of electric vehicles
As Li-ion battery prices continue to drop, more and more people are buying EV cars. An increasing number of cities, local governments and utility companies are developing programs for vehicles and infrastructure upgrades, bringing about greater opportunities for design engineers to contribute new innovative designs.
44 million EV sales estimated by 2030
Market trends
Affordability
Cost of lithium-ion batteries continue to drop; we will soon reach price parity between gas powered and electric vehicles
Electrification
Heavy vehicles will become electrified thanks to advancements in battery chemistry, tightening emissions regulations, and more models coming online
Availability
As of 2019, there are 20,000+ public EV charging stations with 68,800+ connectors across the U.S.
Home charging
80%
of charging is done at home
Workplace charging
600+
Over 600 workplaces in the US have installed 5,500+ charging stations
2x
Worldwide public charges have doubled in the past 3 years
Other places to charge
Restaurants
Malls
Hospitals
Rest Stops
What engineers need
Efficient wireless connectivity
High-quality transmissions in wireless devices in a wide variety of frequencies
Miniaturization
Miniaturized components designed for smaller spaces to maximize space-savings and minimize weight
Durability
Ruggedized components and sealed connectors should be used when exposed to harsh elements and vibrations
Weather resistant
Withstand extreme hot and cold climates
Thermal management
Reduce heat in EV motors to improve reliability and prevent premature failure
Modularity
The right interconnects can help design engineers adapt to continually push the boundaries of design
Featured products
TE Connectivity's MULTI-BEAM Plus Power Connectors
Provide a maximum of 140A per contact or 100A per contact per four adjacent contacts
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TE Connectivity's High Density+ (HD+) Card Edge Power Connectors
Delivers high-current density at 15A/2.54mm and supports up to 3000W power supplies
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TE Connectivity's ICCON Block and ICCON Insert High Power Pins and Sockets
Offer flexible design options for applications up to 350A
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TE Connectivity's ELCON Micro Wire-to-Board Power Solutions
Offer a high current density up to 12.5A per pin (maximum) in the common industry footprint of 3mm (contact pitch)
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TE Connectivity's USB 4.0 Gen 3 Receptacle Connectors
Offer a 20V, 5A rating, and -40°C to +80°C operating temperature range
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TE Connectivity's 1.0MM Centerline Locking HPI Solutions
Offer right angle and vertical PCB mounting orientations and 3 to 15 position sizes
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TE Connectivity's Flexible Printed Circuit (FPC) Connectors
Based on a flex-to-board 0.5mm pitch connector systems with 0.5A maximum current
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